As a core component of the high-tech industry, the semiconductor sector is a key driver for the development of the digital economy and the transformation and upgrading of industries. It imposes extremely stringent requirements on the precision and purity of the production process. The purity, impurity content, and reaction stability of various auxiliary materials directly affect the quality of semiconductor products. Sodium persulfate, as a chemical material with excellent performance and strong applicability, leverages its unique physicochemical properties to play an indispensable role in multiple critical processes in the semiconductor back-end manufacturing, packaging, power devices, and lead frame processing, including cleaning, micro-etching, and surface roughening.
1. Surface Cleaning of Semiconductor Materials
During semiconductor production, various substrate surfaces are prone to contamination by oils, organic residues, and slight oxide layers. If such impurities are not thoroughly removed, they can severely affect subsequent processing steps, even leading to product scrappage and production losses. Sodium persulfate possesses strong oxidizing properties, enabling it to efficiently decompose and remove various organic pollutants from the substrate surface. Under strictly controlled conditions of concentration, temperature, and processing time, the cleaning process is gentle yet effective, capable of penetrating tiny crevices on the substrate surface to achieve the cleaning objective while minimizing damage to the substrate itself. This meets the substrate integrity requirements of semiconductor packaging and back-end manufacturing.
Sodium persulfate produced by Fujian Zhanhua Chemical is characterized by high purity and low impurity content, with impurities such as iron and manganese strictly controlled at very low levels. This effectively prevents secondary contamination of semiconductor substrates during the cleaning process, ensuring that the cleanliness of the substrates meets required standards.
2. Etching of Semiconductor Components
Etching is a critical step in semiconductor production, directly affecting the structural precision of semiconductor components. Its core objective is to remove excess metal or semiconductor material from the substrate surface through specific methods to form fine structures that meet design requirements. Sodium persulfate is widely used in the roughening and etching of back-end semiconductor processing, power devices, and metal layer materials. Leveraging its excellent oxidizing properties, sodium persulfate converts the portions to be removed from the substrate surface into substances that are easily dissolved and eliminated, achieving precise and uniform etching. The etching result is consistently uniform, meeting the demand for precision and miniaturization in semiconductor components and helping to improve their structural accuracy and performance stability.
Fujian Zhanhua Chemical has established a strict production quality control system, rigorously managing every step from raw material selection to production. The sodium persulfate produced has a stable and compliant active oxygen content, ensuring uniform and sustained oxidation during the etching process and effectively preventing issues such as uneven etching depth or edge burrs caused by fluctuations in active oxygen content, thereby guaranteeing stable etching results.
3. Surface Roughening of Lead Frames
The lead frame, as the core component connecting semiconductor components to external circuits, serves as an important carrier for signal transmission and power supply in semiconductor products. Its surface roughness affects the stability of subsequent processes such as soldering and packaging, thereby determining the reliability and service life of semiconductor components. Sodium persulfate can be used for surface roughening of lead frames. Through a controlled chemical reaction, it moderately corrodes the lead frame surface to form a uniformly rough surface structure, thereby enhancing the bonding strength with encapsulation materials. After treatment, the lead frame better adapts to subsequent soldering and packaging processes, reducing the incidence of poor connections or detachment, and effectively ensuring the overall performance of semiconductor components.
Post time: May-20-2026
